BAS35

BAS35, BAS35,215

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Description

Parameters

ParameterBAS35,215
IC package
Package
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Manufacturer
Manufacturer
NXP Semiconductors
Forvard voltage
UF
900 mVIf = 100mA
Reverse voltage
UR
<90 V
Forvard current
IF
<200 mA
Reverse current
IR
<100 nAUr = 90V
Type of mounting a component on a board/circuit
Mount
Surface mount
Recovery time
tREC
<50 ns
Diode technology
Technology
Avalanche
Diode speed class
Speed
Fast Recovery
Diodes connection type in assembly
Connection
2 (Common Anode)