MMBFJ270

MMBFJ270

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Description

Parameters

ParameterMMBFJ270
IC package
Package
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Manufacturer
Manufacturer
Fairchild Semiconductor
Type of mounting a component on a board/circuit
Mount
Surface mount
Power dissipation
P
<225 mW
Cutoff voltage
U0
500 mVId = 1nA
Continuous drain current
IDSS
>2 mAmin.: Vgs=0; Vds=15V
FET channel type
Channel
P-ch
Gate-source breakdown voltage
VBRGSS
>30 V