BSR57

BSR57, BSR57,215

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Description

Parameters

ParameterBSR57,215
IC package
Package
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Manufacturer
Manufacturer
NXP Semiconductors
Type of mounting a component on a board/circuit
Mount
Surface mount
Power dissipation
P
<250 mW
Cutoff voltage
U0
5 VId = 0.5nA
Continuous voltage between drain and source
UDSS
<40 V
Continuous drain current
IDSS
>20 mAmin.: Vgs=0; Vds=15V
FET channel type
Channel
N-ch
Channel resistance at ON state
RDS-ON
<40 Ω
Gate-source breakdown voltage
VBRGSS
>40 V